1. Capabilities of the surface mount production line:

  • Types of installed components: different types ranging from 0201, BGA, μBGA, CSP, FLIP CHIP;
  • Minimum component lead pitch: 0.3 mm;
  • Maximum component size: 50 * 50 mm, connectors up to 75 mm long;
  • Maximum component height: 15 mm;
  • Maximum PCB size: 460 * 400mm;
  • Thickness of the PCB to be mounted: 0.38 — 4.2 mm;
  • Mounting accuracy: ± 30 μm (at 3 sigma);
  • Lead-Free: Yes.

2. Possibility of selective soldering area:

  • Maximum PCB size: 508 * 460mm;
  • Maximum PCB size: 508 * 460mm;
  • Maximum weight of the PCB with components: 8 kg;
  • Maximum height of components on the top side of the PCB: 120 mm;
  • Maximum height of components on the underside of the PCB: 30 mm;
  • Lead-Free: Yes.

3. Possibilities of the PCB cleaning area:

  • Maximum PCB size: 508 * 460mm;
  • PCB cleaning method: jet method;
  • Cleaning fluid: Vigon A250;
  • Final cleaning of PCB: deionized water (conductivity not exceeding 10 μS).